
Application expertise and a clear understanding of your adhesive, process, and production requirements.
Serving manufacturers across the Americas
The Bond Lab combines application expertise with European engineering and proven equipment platforms to deliver adhesive solutions built around each manufacturing process.
In partnership with Meltwood, IDEALTECH and UES, we bring specialized adhesive technology and technical support to manufacturers throughout the Americas.
The relationship starts with your manufacturing requirements—not a catalog of machines.

Application expertise and a clear understanding of your adhesive, process, and production requirements.

European engineering and application-specific adhesive system configuration across a range of manufacturing processes.

Equipment technology for precision adhesive handling, dependable flow, and configurable system architecture.

Hot melt technology supporting accurate delivery, consistent process control, and production-line integration.
Selected, configured, and supported around the realities of the application.

Technology & Engineering Partner
The Bond Lab and Meltwood collaborate with IDEALTECH and UES to develop application-specific equipment configurations and features, with particular expertise in profile wrapping and laminating.
The DM20 and DM200 are examples of Meltwood-engineered configurations that incorporate industry-specific modifications around proven IDEALTECH equipment technology.
Profile Wrapping & Edge Banding
A Meltwood-engineered configuration optimized for profile wrapping applications and well suited for high-speed edge banding. Built on IDEALTECH equipment technology with application-specific features developed around the requirements of these manufacturing processes.
Profile Wrapping & Flat Lamination
Engineered specifically for profile wrapping and decorative flat lamination, the Meltwood DM200 combines IDEALTECH equipment technology with application-focused engineering designed to support consistent adhesive delivery, reduced thermal stress and intuitive system control.
Illustrative equipment platforms show how engineering decisions translate into practical production benefits.

Equipment is configured around the manufacturing process rather than selected as a stand-alone machine.

The melting and delivery system is considered as one process to support dependable production performance.

An easy-to-use interface allows operators to adjust system parameters as production conditions and adhesive requirements change.
Adhesive equipment should not be selected from a catalog in isolation. Temperature, adhesive chemistry, coat weight, line speed, application width, production continuity and process requirements all influence system design.
The Bond Lab works with customers and our technology partners to evaluate these requirements and configure the appropriate adhesive melting and delivery solution.
Tell us about your adhesive, application and production requirements. The Bond Lab will work with our technology partners to identify and configure the right system for your process.